◆ The use of visual inspection, replace the visual inspection that is not stable (optional)
◆ The device is a fully automatic burner plug-in equipment for chip sticking (heat sealing), instead of artificial
◆ Support a variety of IC packaging of the Zhuan (heat sealing)
◆ Material bandwidth 8 ~ 32mm
◆ Optional self-adhesive or heat-sealed type
◆ Support ink print module, laser print module (optional)
◆ Simplified Chinese interface, simple operation
◆ Equipped with inspection module
◆ High flexibility, for different IC, adjust the light source and optical function, to achieve the best test
◆ Optional black and white camera or color camera
◆ Reduce the involvement of operating personnel, to maximize production capacity, quality optimization
◆ Secondary re-examination function
New generation of discharge device
◆ After the material is burned, it is placed directly into the tape, allowing the device to achieve the highest performance
◆ The marking device is at the front of the membrane of the machine so as not to affect the discharge of the equipment
◆ Ink printing can support RBI, digital, English letters a number of functions
◆ IC code is printed inspection(MARK)
◆ IC orientation test(Orientaion)
◆ IC marking quality inspection(Dot)
◆ IC pin test(Scan)
◆ Tape sealing test(Seal)
◆ Stacking test(Stack)
◆ Empty material detection(Empty)
Support IC package type | All reel packaging |
IC move the module | Servo stepper motor |
Print module | Ink print module: single point (0.8mm ~ 2.0mm) Single English (2mm ~ 3mm) Single digit (2mm ~ 3mm) Laser Print Module: |
Image view | Phase device: camera: 1.3 million pixel camera |
Air pressure source | 0.6Mpa,55L/min |
power supply | Input voltage: 220 ~ 240VAC single phase Input frequency: 50 ~ 60HZ Rated power: 1.3KVA |